1. Layer: 1-30
2. Board finished thickness:0.21mm-7.0mm
3. Material: FR-4,CEM-1,CEM-3, High TG, FR4Halogen Free, Rogers
4. Max. finished board size: 23-25(580mm*900mm)
5. Min. ldrilled hole size: 3mil(0.075mm)
6. Min. line width: 3mil(0.075mm)
Min. Line spacing: 3mil(0.075mm)
7. Surface finish/treatment: HASL/HASL lead free, HAL,
8. Copper thickness in hole: >25.0um.(>1mil)
9. Inner Packing: Vacuum packing/Plastic bad
Outer packing: Standard carton packing
10. Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076,NPTH: ±0.05
11. Certificate: UL, ISO9001, ISO14001,SGS,RoHS
12. Special requirements: Buried and blind vias +controlled Impedance + BGA
13. Profiling: Punching, Routing, V-CUT, Beveling
14. Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
2. Board finished thickness:0.21mm-7.0mm
3. Material: FR-4,CEM-1,CEM-3, High TG, FR4Halogen Free, Rogers
4. Max. finished board size: 23-25(580mm*900mm)
5. Min. ldrilled hole size: 3mil(0.075mm)
6. Min. line width: 3mil(0.075mm)
Min. Line spacing: 3mil(0.075mm)
7. Surface finish/treatment: HASL/HASL lead free, HAL,
8. Copper thickness in hole: >25.0um.(>1mil)
9. Inner Packing: Vacuum packing/Plastic bad
Outer packing: Standard carton packing
10. Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076,NPTH: ±0.05
11. Certificate: UL, ISO9001, ISO14001,SGS,RoHS
12. Special requirements: Buried and blind vias +controlled Impedance + BGA
13. Profiling: Punching, Routing, V-CUT, Beveling
14. Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
Main Products
Electronic Component